ZHAO, Gang; SONG, Cen; WU, Binghan. 3D Integrated Circuit (3D IC) Technology and Its Applications. Journal of Industrial Engineering and Applied Science, London, U.K., v. 2, n. 4, p. 60–65, 2024. DOI: 10.5281/zenodo.12794429. Disponível em: https://www.suaspress.org/ojs/index.php/JIEAS/article/view/v2n4a10. Acesso em: 5 may. 2025.