Human in the Loop AI EDA for Chip Design
DOI:
https://doi.org/10.70393/6a6374616d.333732ARK:
https://n2t.net/ark:/40704/JCTAM.v3n1a05Disciplines:
Artificial Intelligence TechnologySubjects:
Machine LearningReferences:
28Keywords:
Human in The Loop Learning, Electronic Design Automation, Chip Placement and Routing, Preference Feedback, Cost–benefit AnalysisAbstract
Currently, chip design automation is hampered by factors such as data scarcity, difficulty in sharing, and high costs associated with design rules and verification. Based on the research trajectory of human-machine collaborative learning, this paper proposes a modular framework that embeds expert feedback into three stages: data processing, model training, and system-level intervention, implementing it within the placement and routing workflow. With less human input, the number of iterations decreases. Economic accounting connects marginal quality gains with human and computing costs, exhibiting diminishing returns and context-dependent optimal feedback budgets.
References
[1] Chowdhury, A. B. (2024). Data-Driven EDA: Harnessing the Power of Machine Learning for Chip Design (Doctoral dissertation, New York University Tandon School of Engineering).
[2] Amuru, D., & Abbas, Z. (2024). AI-Assisted Circuit Design and Modeling. In AI-Enabled Electronic Circuit and System Design: From Ideation to Utilization (pp. 1-40). Cham: Springer Nature Switzerland.
[3] Chen, Y. (2025). Artificial Intelligence in Economic Applications: Stock Trading, Market Analysis, and Risk Management. Journal of Economic Theory and Business Management, 2(5), 7-14.
[4] Huang, S. (2025). Prophet with Exogenous Variables for Procurement Demand Prediction under Market Volatility. Journal of Computer Technology and Applied Mathematics, 2(6), 15-20.
[5] Cao, S., Wang, J., & Tse, T. K. (2023). Life‐cycle cost analysis and life‐cycle assessment of the second‐generation benchmark building subject to typhoon wind loads in Hong Kong. The Structural Design of Tall and Special Buildings, 32(11-12), e2014.
[6] Yin, M. (2025). Predictive Maintenance of Semiconductor Equipment Using Stacking Classifiers and Explainable AI: A Synthetic Data Approach for Fault Detection and Severity Classification. Journal of Industrial Engineering and Applied Science, 3(6), 36-46.
[7] Kanagal, R. (2025). LLM-Powered EDA Log Analysis for Effective Design Debugging.
[8] Wang, J., Kudagama, B. J., Perera, U. S., Li, S., & Zhang, X. (2025). Framework for generating high-resolution Hong Kong local climate projections to support building energy simulations. Physics of Fluids, 37(3).
[9] Wang, J., Golnary, F., Li, S., Weerasuriya, A. U., & Tse, K. T. (2024). A review on power control of wind turbines with the perspective of dynamic load mitigation. Ocean Engineering, 311, 118806.
[10] Wang, C., Yang, F., & Zhu, K. (2024, August). AI-Enabled Layout Automation for Analog and RF IC: Current Status and Future Directions. In 2024 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (pp. 1-3). IEEE.
[11] Shrirao, N. M. (2024, September). Intelligent design automation in VLSI systems: Leveraging AI for future electronics applications. In ECCSUBMIT Conferences (Vol. 2, No. 3, pp. 28-39).
[12] Cirstea, M., Benkrid, K., Dinu, A., Ghiriti, R., & Petreus, D. (2024). Digital electronic system-on-chip design: Methodologies, tools, evolution, and trends. Micromachines, 15(2), 247.
[13] Yin, M. (2025). Data Quality Control in Semiconductor Manufacturing through Automated ETL Processes and Class Imbalance Handling Techniques. Journal of Industrial Engineering and Applied Science, 3(6), 13-22.
[14] Islam, R. (2022). Early stage DRC prediction using ensemble machine learning algorithms. IEEE Canadian Journal of Electrical and Computer Engineering, 45(4), 354-364.
[15] Wang, J., Tse, T. K., Li, S., & Fung, J. C. (2023). A model of the sea–land transition of the mean wind profile in the tropical cyclone boundary layer considering climate changes. International Journal of Disaster Risk Science, 14(3), 413-427.
[16] Yin, M. (2025). A Data-Driven Approach for Real-Time Bottleneck Detection and Optimization in Semiconductor Manufacturing Using Active Period Method and Visualization. Academic Journal of Natural Science, 2(4), 19-26.
[17] Sabato, S. (2025). Impact of Adoption of AI in SOC Design Flow. In SOC-Based Solutions in Emerging Application Domains (pp. 173-181). Cham: Springer Nature Switzerland.
[18] Yin, M. (2025). Robust Bilevel Network-Flow Scheduling for Semiconductor Wafer Logistics under WLTP Uncertainty.
[19] Sun, Y., & Ortiz, J. (2024). An ai-based system utilizing iot-enabled ambient sensors and llms for complex activity tracking. arXiv preprint arXiv:2407.02606.
[20] Thakur, G., & Jain, S. (2025). Role of Artificial Intelligence in VLSI Design: A Review. Recent Advances in Computer Science and Communications, 18(1), E250424229315.
[21] Pang, F. (2020, November). Research on Incentive Mechanism of Teamwork Based on Unfairness Aversion Preference Model. In 2020 2nd International Conference on Economic Management and Model Engineering (ICEMME) (pp. 944-948). IEEE.
[22] Chen, Yinlei. "Daily Asset Pricing Based on Deep Learning: Integrating No-Arbitrage Constraints and Market Dynamics." Journal of Computer Technology and Applied Mathematics 2.6 (2026): 1-10.
[23] Krist, C. (2025). 17.1 Considering How to Include Human-in-the-Loop, and When to Utilize Which Tools, as Informed by the (Science) Education Literature. Applying Machine Learning in Science Education Research, 339.
[24] Pang, F. (2025). Animal Spirit, Financial Shock and Business Cycle. European Journal of Business, Economics & Management, 1(2), 15-24.
[25] Chen, Y. (2025). Generative Diffusion Models for Option Pricing: A Novel Framework for Modeling Volatility Dynamics in US Financial Markets. Journal of Industrial Engineering and Applied Science, 3(6), 23-29.
[26] Guven, I., Parlak, M., Lederer, D., & De Vleeschouwer, C. (2025). AI-Driven Integrated Circuit Design: A Survey of Techniques, Challenges, and Opportunities. IEEE Access.
[27] Manohar, R., Pingali, K., Burtscher, M., Joshi, P., & Guthau, M. (2024). An Intelligent Design Environment For Asynchronous Logic (IDEAL).
[28] Najam, L. A., & Luedkea, R. H. (2024, March). AI-Enhanced Design Automation for Next-Gen Electronics Applications and VLSI Systems. In ECCSUBMIT Conferences (Vol. 2, No. 1, pp. 47-56).
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