About the Journal

Journal of Intelligence and Engineering Technology (JIET) is a scholarly journal published by SUAS. It employs editor-invited peer review and editorial assessment through a standardized scoring framework evaluating submissions on originality, transparency, ethical integrity, and domain relevance.

Quarterly publication with Online First.

It covers domains including Intelligent Systems, Smart Manufacturing, Cyber–Physical Engineering, Engineering Data Science, Sustainable Infrastructure, Intelligent Materials, Human-Centered AI, Engineering Cybersecurity, and Emerging Convergent Engineering Domains; assigns DOIs and ARKs; and is indexed in WorldCat, OpenAIRE, Scilit, and BASE.

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Current Issue

Vol. 1 No. 1 (2026)
View Vol. 1 No. 1 (2026)

This issue contains articles accepted following editor-invited peer review and editorial assessment. All manuscripts underwent standardized similarity screening as part of SUAS Press’s quality assurance protocol.

Articles: 5 (pp. 1-34)

For scientific inquiries about a specific article, contact the corresponding author directly. To report concerns regarding editorial integrity, publication ethics, or content quality, please contact the SUAS Press Quality Supervision Committee at qsc@suaspress.org.

Published: 2026-02-04

Articles

  • Constructing a Multi-Objective Decision-Making Model for Investment Valuation of Technological Innovation Projects: a Blockchain–Big Data Fusion Perspective
    Authors: Yuanchu Liu
    Resource Type: Article
    Disciplines: Computer Science | Subjects: Big Data
    Publication ID: v1n1a01
    Abstract: Technological innovation projects are notoriously difficult to value due to their high uncertainty and the coupling of multiple value dimensions. Traditional valuation approaches suffer from several critical limitations, including insufficient...
    1-10
    DOI Icon Abstract views: 0 | DOI Icon PDF downloads: 0 | DOI Icon references: 27
    DOI Icon DOI: 10.70393/6a696574.333835
    DOI Icon ARK: ark:/40704/JIET.v1n1a01
  • Multi-Chain DAO Treasury Management: a Risk and Compliance Optimization Framework for the U.S. Ecosystem
    Authors: Allen Lin
    Resource Type: Article
    Disciplines: Computer Science | Subjects: Risk and Compliance Optimization Framework
    Publication ID: v1n1a02
    Abstract: Multi-chain deployment has become a mainstream strategy for U.S.-based DAOs, yet treasury management faces three core bottlenecks: cross-chain liquidity fragmentation, inadequate compliance with U.S. regulations (including OFAC sanctions screening...
    11-18
    DOI Icon Abstract views: 0 | DOI Icon PDF downloads: 0 | DOI Icon references: 29
    DOI Icon DOI: 10.70393/6a696574.333834
    DOI Icon ARK: ark:/40704/JIET.v1n1a02
  • Uniswap V4 Concentrated Liquidity Pricing: a Machine Learning Model for U.S. Institutional Liquidity Providers
    Authors: Allen Lin
    Resource Type: Article
    Disciplines: Computer Science | Subjects: Machine Learning Model
    Publication ID: v1n1a03
    Abstract: Amid the institutionalization wave of Decentralized Finance (DeFi), U.S. institutional Liquidity Providers (LPs) have emerged as the core incremental capital for leading Decentralized Exchanges (DEXs). However, the adaptation gap between Uniswap...
    19-26
    DOI Icon Abstract views: 0 | DOI Icon PDF downloads: 0 | DOI Icon references: 25
    DOI Icon DOI: 10.70393/6a696574.333836
    DOI Icon ARK: ark:/40704/JIET.v1n1a03
  • Integrating Real-Time KPI Dashboards with Monte Carlo Simulation for Optimizing Semiconductor Manufacturing Processes
    Authors: Min Yin
    Resource Type: Article
    Disciplines: Computer Science | Subjects: AI
    Publication ID: v1n1a04
    Abstract: Currently, wafer fabs in semiconductor applications rely heavily on experience. Errors in production scheduling strategies, maintenance plans, and resource allocation can lead to downtime, scrap, and delivery delays. This research proposes an...
    27-39
    DOI Icon Abstract views: 0 | DOI Icon PDF downloads: 0 | DOI Icon references: 25
    DOI Icon DOI: 10.70393/6a696574.333837
    DOI Icon ARK: ark:/40704/JIET.v1n1a04
  • Risk Transmission Mechanisms and Risk Mitigation Pathways in Cross-border Technology Investment: Evidence From the China–U.S. Market
    Authors: Yuanchu Liu
    Resource Type: Article
    Disciplines: Computer Science | Subjects: Risk Transmission Mechanism
    Publication ID: v1n1a05
    Abstract: Against the backdrop of accelerating cross-border mobility of global technological factors, the scale of China–U.S. cross-border technology investment has continued to expand, yet the investment failure rate reaches 37.2%, significantly higher...
    40-49
    DOI Icon Abstract views: 0 | DOI Icon PDF downloads: 0 | DOI Icon references: 25
    DOI Icon DOI: 10.70393/6a696574.333838
    DOI Icon ARK: ark:/40704/JIET.v1n1a05
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