3D Integrated Circuit (3D IC) Technology and Its Applications
DOI:
https://doi.org/10.5281/zenodo.12794429ARK:
https://n2t.net/ark:/40704/JIEAS.v2n4a10Keywords:
3D IC Technology, Vertical integration, Through-silicon Vias (TSVs), High-performance Computing, Wafer-to-wafer Bonding, Die-to-wafer Bonding, Power Efficiency, Thermal ManagementAbstract
The advent of 3D Integrated Circuit (3D IC) technology marks a significant milestone in the evolution of semiconductor devices. By stacking multiple layers of active devices vertically, 3D ICs offer substantial improvements in performance, power efficiency, and integration density compared to traditional two-dimensional (2D) designs. This paper explores the principles, methodologies, and applications of 3D IC technology, highlighting its advantages, challenges, and future prospects. Through comprehensive analysis and experimental data, we demonstrate the effectiveness of 3D ICs in various applications, including high-performance computing, mobile devices, and memory systems.
Our findings indicate that 3D ICs can significantly enhance the computational efficiency and energy utilization of semiconductor devices. The experimental data presented supports the potential of 3D IC technology in achieving higher performance metrics while maintaining energy efficiency. [3]This paper also discusses the key challenges in implementing 3D ICs, such as thermal management, manufacturing complexity, and design verification. Future prospects include the development of advanced fabrication techniques and materials to overcome these challenges and fully realize the benefits of 3D ICs.
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