3D Integrated Circuit (3D IC) Technology and Its Applications
DOI:
https://doi.org/10.5281/zenodo.12794429ARK:
https://n2t.net/ark:/40704/JIEAS.v2n4a10Keywords:
3D IC Technology, Vertical integration, Through-silicon Vias (TSVs), High-performance Computing, Wafer-to-wafer Bonding, Die-to-wafer Bonding, Power Efficiency, Thermal ManagementAbstract
The advent of 3D Integrated Circuit (3D IC) technology marks a significant milestone in the evolution of semiconductor devices. By stacking multiple layers of active devices vertically, 3D ICs offer substantial improvements in performance, power efficiency, and integration density compared to traditional two-dimensional (2D) designs. This paper explores the principles, methodologies, and applications of 3D IC technology, highlighting its advantages, challenges, and future prospects. Through comprehensive analysis and experimental data, we demonstrate the effectiveness of 3D ICs in various applications, including high-performance computing, mobile devices, and memory systems.
Our findings indicate that 3D ICs can significantly enhance the computational efficiency and energy utilization of semiconductor devices. The experimental data presented supports the potential of 3D IC technology in achieving higher performance metrics while maintaining energy efficiency. [3]This paper also discusses the key challenges in implementing 3D ICs, such as thermal management, manufacturing complexity, and design verification. Future prospects include the development of advanced fabrication techniques and materials to overcome these challenges and fully realize the benefits of 3D ICs.
Downloads
Metrics
References
Liu, T., Cai, Q., Xu, C., Zhou, Z., Ni, F., Qiao, Y., & Yang, T. (2024). Rumor Detection with a novel graph neural network approach. arXiv Preprint arXiv:2403. 16206.
Liu, T., Cai, Q., Xu, C., Zhou, Z., Xiong, J., Qiao, Y., & Yang, T. (2024). Image Captioning in news report scenario. arXiv Preprint arXiv:2403. 16209.
Xu, C., Qiao, Y., Zhou, Z., Ni, F., & Xiong, J. (2024a). Accelerating Semi-Asynchronous Federated Learning. arXiv Preprint arXiv:2402. 10991.
Zhou, J., Liang, Z., Fang, Y., & Zhou, Z. (2024). Exploring Public Response to ChatGPT with Sentiment Analysis and Knowledge Mapping. IEEE Access.
Zhou, Z., Xu, C., Qiao, Y., Xiong, J., & Yu, J. (2024). Enhancing Equipment Health Prediction with Enhanced SMOTE-KNN. Journal of Industrial Engineering and Applied Science, 2(2), 13–20.
Zhou, Z., Xu, C., Qiao, Y., Ni, F., & Xiong, J. (2024). An Analysis of the Application of Machine Learning in Network Security. Journal of Industrial Engineering and Applied Science, 2(2), 5–12.
Zhou, Z. (2024). ADVANCES IN ARTIFICIAL INTELLIGENCE-DRIVEN COMPUTER VISION: COMPARISON AND ANALYSIS OF SEVERAL VISUALIZATION TOOLS.
Xu, C., Qiao, Y., Zhou, Z., Ni, F., & Xiong, J. (2024b). Enhancing Convergence in Federated Learning: A Contribution-Aware Asynchronous Approach. Computer Life, 12(1), 1–4.
Wang, L., Xiao, W., & Ye, S. (2019). Dynamic Multi-label Learning with Multiple New Labels. Image and Graphics: 10th International Conference, ICIG 2019, Beijing, China, August 23--25, 2019, Proceedings, Part III 10, 421–431. Springer.
Wang, L., Fang, W., & Du, Y. (2024). Load Balancing Strategies in Heterogeneous Environments. Journal of Computer Technology and Applied Mathematics, 1(2), 10–18.
Wang, L. (2024). Low-Latency, High-Throughput Load Balancing Algorithms. Journal of Computer Technology and Applied Mathematics, 1(2), 1–9.
Wang, L. (2024). Network Load Balancing Strategies and Their Implications for Business Continuity. Academic Journal of Sociology and Management, 2(4), 8–13.
Li, W. (2024). The Impact of Apple’s Digital Design on Its Success: An Analysis of Interaction and Interface Design. Academic Journal of Sociology and Management, 2(4), 14–19.
Wu, R., Zhang, T., & Xu, F. (2024). Cross-Market Arbitrage Strategies Based on Deep Learning. Academic Journal of Sociology and Management, 2(4), 20–26.
Wu, R. (2024). Leveraging Deep Learning Techniques in High-Frequency Trading: Computational Opportunities and Mathematical Challenges. Academic Journal of Sociology and Management, 2(4), 27–34.
Wang, L. (2024). The Impact of Network Load Balancing on Organizational Efficiency and Managerial Decision-Making in Digital Enterprises. Academic Journal of Sociology and Management, 2(4), 41–48.
Chen, Q., & Wang, L. (2024). Social Response and Management of Cybersecurity Incidents. Academic Journal of Sociology and Management, 2(4), 49–56.
Song, C. (2024). Optimizing Management Strategies for Enhanced Performance and Energy Efficiency in Modern Computing Systems. Academic Journal of Sociology and Management, 2(4), 57–64.
Banerjee, K., Souri, S. J., Kapur, P., & Saraswat, K. C. (2001). 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proceedings of the IEEE, 89(5), 602-633.
Knickerbocker, J. U., Andry, P. S., Dang, B., Horton, R., Interrante, M. F., & Patel, C. (2008). 3D silicon integration. IBM Journal of Research and Development, 52(6), 553-569.
Patti, R. S. (2006). Three-dimensional integrated circuits and the future of system-on-chip designs. Proceedings of the IEEE, 94(6), 1214-1224.
Vivet, P., Clermidy, F., Jourdan, S., & Guérin, C. (2008). 3D integration: A promising technology for high performance multi-core platforms. Design, Automation & Test in Europe Conference & Exhibition (DATE), 2008, 167-172.
Xie, Y., Wolf, W., & Chen, H. (2006). Performance, power, and reliability tradeoffs in 3D IC designs. Proceedings of the 43rd annual Design Automation Conference, 2006, 73-78.
Downloads
Published
How to Cite
Issue
Section
ARK
License
Copyright (c) 2024 The author retains copyright and grants the journal the right of first publication.
This work is licensed under a Creative Commons Attribution 4.0 International License.
